BGA Rework
BGA rework on electronic boards
BGA rework, or Ball Grid Array reprocessing, is the repair and reworking of microelectronic components on electronic boards. Thanks to over 50 years of experience in the electronics sector, the technical team at E.L.M.A. Elettronica has developed specialised know-how and, with a forward-looking and innovative mindset, is able to perform BGA component rework on PCBs for its extensive network of customers.
We work with companies in the electromedical, railway, military, industrial, and automotive sectors, both in Italy and internationally.
If you would like to discuss the specifications of your project, our technical team is available to provide detailed support and guidance.
How does BGA rework work?
At E.L.M.A., we are equipped with a dedicated BGA rework station featuring a semi-automatic machine. The process is divided into three key phases:
- Removal of damaged components
- Cleaning of the affected area
- Repositioning and replacement of the component
To restore connections between the BGA components and the board, a controlled sequence of heating and cooling cycles is applied, followed by targeted soldering operations to ensure full system functionality.
We provide third-party services to a wide range of industries and are available to explore collaboration opportunities with all potential customers.
